Support structure for packaging

ABSTRACT

A support structure for packaging is provided for containing, storing and transporting electronic components like liquid crystal modules. The structure includes a bottom plate and first and second side plates provided at respective sides of the bottom plate. Side surfaces of the bottom plate constitute first inclined planes slanted at a first degree. End surfaces of the first and second side plates on the bottom plate side constitute second inclined planes slanted at a second degree. The first and second degrees are selected such that, when the first and second side plates are erected to cause the first and second inclined planes to closely contact with each other, the first and second side plates are prevented from being bent inwards more than 90 degrees.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention generally relates to support structures forpackaging, and more particularly, to a packaging support structure foruse in containing, storing and transporting electronic components likeliquid crystal modules.

[0003] 2. Description of the Background Art

[0004] Japanese Patent Laying-Open Nos. 8-175582 and 9-226867 discloseconventional support frames for packaging formed with synthetic resinfoaming sheets. In each case, a bottom plate and upright side platessurely held in a specific upright state are provided to form a supportframe, or support structure for packaging. Items to be packaged are heldin slit-shaped insert grooves that are formed at portions of the bottomplate and the side plates.

[0005] A support structure conventionally used for packaging primarilyliquid crystal modules has been of the type provided with a bottom plateand side plates formed of synthetic resin foaming sheets, wherein theside plates extend from opposed side edges of the bottom plate viahinges, where they are folded and erected. At the bottom and sideplates, convex portions for partition are provided along the hingeextending direction, with prescribed spacing therebetween to receiverespective items to be packaged.

[0006] The support structure of this type, however, has a structuraldisadvantage that the side plates may be folded inwards more than 90degrees. It exhibits insufficient strength and shock-absorbing propertyagainst falling of the package, and a large shock is delivered to thepackaged items. Thus, it was inappropriate for use in packagingelectronic components, such as liquid crystal modules, which wouldrequire shock-absorbing property and safety of especially high levels.

[0007] Another disadvantage of the conventional support structure forpackaging is that it lacks a function to suppress lateral movement orsinking of a top plate against the side plates that closely contact thepackaged items in a normal supporting state. Thus, at the falling of thepackage, the top plate and the side plates supporting the packaged itemswould separately work to absorb the shock, so that a large shock maylocally be delivered to the packaged items.

[0008] In addition, especially when a small number of items are to bepackaged, the structure lacks capability to securely hold them in fixedpositions. Therefore, it was inappropriate for use as a packaging memberfor electronic components like liquid crystal modules, for whichespecially high-level shock-absorbing property and secure, fixedpositioning would be required.

SUMMARY OF THE INVENTION

[0009] The present invention has been made to solve the above-describedproblems. An object of the present invention is to provide an improvedsupport structure for packaging that is increased in strength withoutdecreasing its shock-absorbing property, to ensure excellentshock-absorbing property and safety. This support structure containsitems in a package and is capable of reducing a shock to be delivered tothe packaged items at falling of the package.

[0010] Another object of the present invention is to provide an improvedsupport structure for packaging that facilitates a packaging operationand allows countermeasures to be taken against dust generationtherefrom.

[0011] According to an aspect of the present invention, a supportstructure for packaging, formed of synthetic resin, for containing anelectronic component is provided. The support structure for packaging isprovided with a bottom plate and side plates. The bottom plate supportsthe electronic component from beneath. The first and second side platesrespectively extend outwards from opposed sides of the bottom plate, andare erected so that they work as supporting members supporting theelectronic component from the sides. End surfaces of the bottom plateeach constitute a first inclined plane that is slanted at a firstdegree. End surfaces of the first and second side plates on the bottomplate sides each constitute a second inclined plane that is slanted at asecond degree. The first degree and the second degree are selected suchthat, when the first and second side plates are erected to cause thefirst and second inclined planes to contact with each other, the firstand second side plates are prevented from being folded inwards more than90 degrees.

[0012] According to another aspect of the present invention, a supportstructure for packaging, formed of synthetic resin, for containing anelectronic component is provided. The support structure for packaging isprovided with a bottom plate, side plates and a top plate. The bottomplate supports the electronic component from beneath. The first andsecond side plates extend outwards from respective sides of the bottomplate, and are erected to form support members supporting the electroniccomponent from the sides. The first side plate has an outer end surfacethat constitutes a first inclined plane. The second side plate has anouter end surface that constitutes a second inclined plane. The topplate works as a lid when the first and second side plates are erected.The top plate has a third inclined plane that closely contacts the firstinclined plane, and a fourth inclined plane that closely contacts thesecond inclined plane. The first and third inclined planes are providedwith concave and convex portions, respectively, so that they areconnected by engagement of the pair of concave and convex portions. Thesecond and fourth inclined planes are provided with concave and convexportions, respectively, so that they are connected by engagement of thepair of concave and convex portions.

[0013] The foregoing and other objects, features, aspects and advantagesof the present invention will become more apparent from the followingdetailed description of the present invention when taken in conjunctionwith the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0014]FIG. 1 is a top plan view of a support structure for packagingaccording to the present invention, which is shown in an unfolded state.

[0015]FIGS. 2A and 2B are cross sectional views of the support structuretaken along the lines A-A and B-B, respectively, in FIG. 1.

[0016]FIG. 3 is a cross sectional view of the support structure takenalong the line C-C in FIG. 1.

[0017]FIG. 4 is an enlarged view of the portion D in FIG. 2.

[0018]FIG. 5 is a perspective view of the support structure forpackaging of the present invention, which is shown in the unfoldedstate.

[0019]FIG. 6 illustrates how the support structure in FIG. 5 is folded.

[0020]FIG. 7 is a perspective view of the support structure forpackaging of the present invention, which is shown in a folded state.

[0021]FIGS. 8A, 8B and 8C are a top plan view, a front cross sectionalview and a side cross sectional view, respectively, of a top plate foruse in the present invention.

[0022]FIG. 9 is a perspective view of the top plate.

[0023]FIG. 10 is an exploded view of the support structure for packagingof the present invention.

[0024]FIGS. 11A, 11B, 11C and 11D are cross sectional views of thesupport structure for packaging of the present invention, which aretaken from the structure in its assembled state.

[0025]FIG. 12 is a perspective view of a side sheet for use in thepresent invention.

[0026]FIGS. 13A, 13B and 13C are a top plan view, a front crosssectional view and a side cross sectional view, respectively, of theside sheet.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0027] The support structure for packaging according to a firstembodiment of the present invention is formed of a solid or foamingsheet of synthetic resin, which may be polyolefin type resin includingpolystyrene type, polypropylene and polyethylene terephthalete, or anyother synthetic resin having suitable rigidity and elasticity and arelatively strong force of restitution. This structure is provided witha stopper function at each end surface of the bottom plate that preventsa corresponding side plate, when folded and erected about a ruled linebetween itself and the bottom plate, from being bent inwards more than90 degrees. The structure is configured, when assembled into a packageform, to suppress delivery of a shock to packaged items at falling ofthe package. It ensures excellent shock-absorbing property and preventsfalling off of the bottom.

[0028] The support structure for packaging according to a secondembodiment of the present invention is provided with another stopperfunction, offered by concave portions formed on side plates, whichcontact packaged items in a normal supporting state, and convex portionsformed on a top pate. This connects the top plate and the side platesclosely together, hindering lateral movement or sinking of the top plateagainst the side plates. Accordingly, a shock at the falling of thepackage is prevented from being delivered to the packaged items.

[0029] The support structure for packaging according to theseembodiments can be used for packaging electronic components like liquidcrystal modules. Specifically, the side surfaces are erected, at 90degrees, about the ruled lines between themselves and the bottom plate.The end surfaces of the bottom plate come to closely contact thecorresponding end surfaces of the respective side plates, preventingbending of the side plates more than 90 degrees. In this state, theitems to be packaged are inserted into slit-shaped insert grooves formedat portions of the side plates. Finally, the convex portions formed atthe top plate are engaged with the concave portions formed at the sideplates contacting the packaged items.

[0030] According to the support structure for packaging of the firstembodiment, the end surfaces of the bottom plates closely contact theend surfaces of the side plates on the bottom plate sides. Thus, astrong structure is provided which prevents delivery of a shock to thepackaged item at falling of the package. This structure exhibitsexcellent shock-absorbing property, and maintains sufficient receivingand supporting strength to endure repeated falling thereof, preventingdelivery of excessive shocks to the packaged items.

[0031] According to the support structure for packaging of the secondembodiment, concave portions are provided to the side plates thatcontact the packaged items in a normal supporting state of thestructure, and convex portions are provided to the top plate, ensuringclose engagement between the side and top plates. Accordingly, a shockat falling of the package can be absorbed evenly through the entiresupport structure, preventing local delivery of the shock to thepackaged items.

EXAMPLES

[0032] Hereinafter, examples of the present invention will be describedwith reference to the drawings.

[0033]FIG. 1 is a top plan view of an example of the support structurefor packaging of the present invention, which is shown in an unfoldedstate.

[0034] The support structure for packaging is integrally formed of asolid sheet of synthetic resin, which may be polyolefin type resinincluding polystyrene type, polypropylene and polyethyleneterephthalete, or any other synthetic resin having suitable rigidity andelasticity and a relatively strong force of restitution. FIGS. 2A and 2Bare cross sectional views of the support structure, taken along therespective lines A-A and B-B in FIG. 1. FIG. 3 is a cross sectional viewof the structure taken along the line C-C in FIG. 1. FIG. 4 is anenlarged view of the encircled portion D in FIG. 2. FIG. 5 is aperspective view of the support structure for packaging.

[0035] Referring to FIGS. 1, 2A, 2B, 3, 4 and 5, the support structurefor packaging is provided with a bottom plate 2, a first side plate 1and a second side plate 1. Bottom plate 2 supports electronic components(not shown) from beneath. First side plate 1 and second side plate 1extend outwards from the respective sides of bottom plate 2 and arefolded inwards to become support members for supporting the electroniccomponents from the sides. End surfaces 4 of bottom plate 2 eachconstitute a first inclined plane that is slanted at a first degree.Respective end surfaces 5, 5 of first and second side plates 1, 1 on thebottom plate side each constitute a second inclined plane that isslanted at a second degree.

[0036] The first degree and the second degree are selected such that,when first and second side plates 1, 1 are folded inwards to cause firstinclined plane 4 and second inclined plane 5 to closely contact witheach other, first and second side plates 1, 1 are prevented from beingbent inwards more than 90 degrees.

[0037] Bottom plate 2 and the pair of side plates 1, 1 are provided withgrooves 6 for receiving items to be packaged.

[0038] This support structure for packaging is assembled into a packageform by folding side plates 1, 1 about respective ruled lines 3 betweenthemselves and bottom plate 2 at 90 degrees, to cause end surfaces 5, 5of side plates 1, 1 and end surfaces 4, 4 of bottom plate 2 to closelycontact with each other. The items to be packaged are received and setin this package.

[0039]FIG. 6 is a perspective view of the support structure forpackaging, which is shown in the state where first and second sideplates 1, 1 are now being folded inwards.

[0040]FIG. 7 is a perspective view of the support structure forpackaging in its folded state. According to the present invention, endsurfaces 4, 4 of bottom plate 2 of the support structure closely contactrespective end surfaces 5, 5 of first and second side plates 1, 1 on thebottom plate side. A space is created with bottom plate 2 and sideplates 1, 1 against falling of the package, so that it becomes a strongstructure capable of suppressing delivery of a shock to the packageditems. The structure exhibits excellent shock-absorbing property againstfalling of the package, and maintains sufficient receiving andsupporting strength to endure repeated falling thereof.

[0041] In the state where side plates 1, 1 are erected at 90 degreesabout respective ruled lines 3, the items to be packaged are insertedinto slit-shaped insert grooves 6 formed on opposing side plates 1, 1.This ensures secure, fixed positioning of the packaged items, andimproves workability thereof.

[0042]FIG. 8A is a top plan view of a top plate for use in the presentinvention. FIGS. 8B and 8C are cross sectional views thereof, takenalong the lines B-B and A-A, respectively, in FIG. 8A. FIG. 9 is aperspective view of the top plate.

[0043] Referring to FIGS. 2A, 2B, 7, 8A, 8B and 8C, an outer end surface5 a of first side plate 1 constitutes a first inclined plane. An outerend surface 5 b of second side plate 1 constitutes a second inclinedplane. Top plate 9 is used, when first and second side plates 1, 1 areerected, to cover them from the top. Top plate 9 has a third inclinedplane 9 a that closely contacts first inclined plane 5 a of first sideplate 1, and a fourth inclined plane 9 b that closely contacts secondinclined plane 5 b of second side plate 1.

[0044] Third and fourth inclined planes 9 a and 9 b are both providedwith convex portions 8. First inclined plane 5 a of first side plate 1and second inclined plane 5 b of second side plate 1 are both providedwith concave portions 7.

[0045] Referring to FIG. 10, items to be packaged 11 are slid intogrooves 6 and covered with top plate 9 from above. At this time, firstinclined plane 5 a and third inclined plane 9 a are connected and fixedwith each other as convex portion 8 and concave portion 7 engage witheach other. Similarly, second inclined plane 5 b and fourth inclinedplane 9 b are connected securely by engagement of convex portion 8 andconcave portion 7.

[0046] According to the support structure for packaging of this example,top plate 9 is prevented from moving in a lateral direction with respectto side plates 1, 1. Top pate 9 is also prevented from sinking below theinclined planes of side plates 1, 1. Accordingly, top plate 9 and sideplates 1, 1 are tightly connected, and securely held with each other.

[0047]FIGS. 11A and 11B are cross sectional views of the supportstructure for packaging in the assembled state, taken along the linesE-E and F-F in FIG. 10. FIG. 11C is a detailed view of the encircledportion D in FIG. 11A. FIG. 11D is an enlarged view of the encircledportion E in FIG. 11 A.

[0048] Referring to FIGS. 11A, 11B, 11C and 11D, the item to be packaged11 is inserted and held in groove 6. Convex portions 8, 8 provided atrespective ends of top plate 9 are engaged with concave portions 7, 7provided at respective side plates 1, 1. First inclined planes 4, 4 atrespective end surfaces of bottom plate 2 are closely contacted withsecond inclined planes 5, 5 provided at end surfaces of respective sideplates 1, 1 on the bottom plate sides.

[0049]FIG. 12 is a perspective view of a side sheet shown in FIG. 10.FIGS. 13A, 13B and 13C are a top plan view, a front cross sectional viewand a side cross sectional view, respectively, of this side sheet.

[0050] According to the support structure for packaging of the presentinvention, the bottom plate and the upright side plates at itsrespective sides are readily positioned and held in a fixed relationshipwith each other, so that it is possible to easily and safely insert andremove items being packaged.

[0051] Further, as the bottom plate and the side plates are formed asone piece, the parts count is low. As the items being packaged can bestacked one on another, transport cost of the packaged items isadvantageously decreased. A bulk ratio of packaging space can also beset small, so that the storage efficiency is improved.

[0052] Although the present invention has been described and illustratedin detail, it is clearly understood that the same is by way ofillustration and example only and is not to be taken by way oflimitation, the spirit and scope of the present invention being limitedonly by the terms of the appended claims.

What is claimed is:
 1. A support structure for packaging, formed ofsynthetic resin, for containing an electronic component, comprising: abottom plate supporting said electronic component from beneath; and afirst side plate and a second side plate extending outwards fromrespective sides of said bottom plate and erected to form supportmembers supporting said electronic component from sides, said bottomplate having end surfaces each forming a first inclined plane slanted ata first degree, said first and second side plates having end surfaces onsaid bottom plate side each forming a second inclined plane slanted at asecond degree, and said first degree and said second degree beingselected such that, when said first and second side plates are erectedto cause said first inclined plane and said second inclined plane toclosely contact with each other, said first and second side plates areprevented from being bent inwards more than 90 degrees.
 2. A supportstructure for packaging, formed of synthetic resin, for containing anelectronic component, comprising: a bottom plate supporting saidelectronic component from beneath; a first side plate and a second sideplate extending outwards from respective sides of said bottom plate anderected to form support members supporting said electronic componentfrom sides, said first side plate having an outer end surface forming afirst inclined plane, and said second side plate having an outer endsurface forming a second inclined plane; and a top plate covering saiderected first and second side plates on top, said top plate having athird inclined plane for close contact with said first inclined planeand a fourth inclined plane for close contact with said second inclinedplane, said first inclined plane and said third inclined plane beingconnected with each other by engagement of a pair of concave portion andconvex portion provided separately at said first and third inclinedplanes, respectively, and said second inclined plane and said fourthinclined plane being connected with each other by engagement of a pairof concave portion and convex portion provided separately at said secondand fourth inclined planes, respectively.